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module packaging in Chinese

Pronunciation:
How to pronounce "module packaging""module packaging" in a sentence

Translationmobile phoneMobile

  • 模塊包
  • 模塊組

Examples

  • If you have created a modules package , you ll need to install that package as well
    如果您創(chuàng)建了一個模塊軟件包，也要同時安裝該軟件包。
  • If you have created a modules package , e . g . , if you have pcmcia , you ll need to install that package as well
    如果您創(chuàng)建了一個模塊軟件包，例如pcmcia ，您也必須同時安裝該軟件包。
  • During this process , waspostupgrade also creates web modules packaged in war files and ejb modules packaged in jar files
    在這個過程中， waspostupgrade也創(chuàng)建被打包在war文件中的web模塊和被打包在jar文件中的ejb模塊。
  • Results in the paper will supply references to thermal designs of multi - chip module packaging based on diamond material
    本文對金剛石材料在多芯片組件熱性能改善和熱應(yīng)力研究,對金剛石在多芯片組件封裝熱設(shè)計應(yīng)用具有一定的參考價值和提供一定的理論依據(jù)。
  • In this paper outlining the characteristics of diamond substrate and problems to be faced with , and measures to be taken , introducing knowledge of multi - chips modules packaging
    本文首先綜述了熱沉用金剛石基板的特點和面臨的問題及相應(yīng)的措施;并介紹了多芯片組件封裝技術(shù)相關(guān)知識。
  • Based on the different requirements on the operating mode , the back surface cooling package style by impinge cooler and the module package style by micro - channels coolers were studied respectively
    根據(jù)對二極管激光器不同工作模式要求，分別研究了采用沖擊式冷卻器的背冷式二維陣列封裝和微通道冷卻的模塊化封裝。
  • Either your clients must download the sdk ( including the extra 30 mb of developer code and documentation ) or you must prepare a runtime module package yourself as a separate download from your application
    你的客戶必須下載sdk （包括額外的30mb開發(fā)者編碼和文件） ，或者你必須自己準(zhǔn)備一個運行時間模型，作為你的應(yīng)用軟件的一個單獨的下載文件。
  • Being based on actual multi - chips module packaging structure a three dimensional thermal analysis model is built , thermal analysis on multi - chips module is conducted using diamond substrate and thermal interfacial materials ; a two dimensional and three dimensional chip - adhesive ? substrate thermal stress model are built , and interfacial thermal stress distributions are computed based on different area ratios and thickness ratios of substrate to chip
    本文根據(jù)實際的多芯片組件的封裝結(jié)構(gòu),建立了三維溫度場分析模型,分析了金剛石作為導(dǎo)熱層和基板對多芯片組件散熱性能的改善;建立了二維和三維的芯片-粘結(jié)層-基板熱力學(xué)模型,分析了不同的基板/芯片厚度比和面積比對層間熱應(yīng)力分布的影響。
What is the meaning of module packaging in Chinese and how to say module packaging in Chinese? module packaging Chinese meaning, module packaging的中文，module packaging的中文，module packaging的中文，translation, pronunciation, synonyms and example sentences are provided by ichacha.net.